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ISCAS 2026

Stabil1 Meldungen1 QuellenZuletzt aktualisiert: 25.05.2026

Verwandte ThemenHuawei Kirin processor LogicFolding semiconductor chip manufacturing US sanctions He Tingbo 1.4 nm

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Huawei unveils revolutionary LogicFolding architecture and new Kirin processor targeting 1.4 nm

Technik·25.05.2026KI-Zusammenfassung

Huawei unveils revolutionary LogicFolding architecture and new Kirin processor targeting 1.4 nm

Huawei introduced its revolutionary LogicFolding architecture and a new Kirin processor targeting 1.4 nm production. This innovation aims to overcome US sanctions by focusing on time-scaling instead of physical shrinking, with a new Kirin chip expected in Fall 2026 and a 1.4 nm equivalent density by 2031.