
In Entwicklung
Technik·26.05.2026KI-Zusammenfassung
Huawei aims for 1.4nm chip density by 2031, bypassing Moore's Law
Huawei announced plans to achieve 1.4nm chip density by 2031, introducing a new 'Tau Extended Law' and 'LogicFolding' design to overcome US restrictions and limitations of Moore's Law. This innovation aims to enhance chip performance by vertically stacking circuits, with the first Kirin chips using this design expected by year-end.
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VnExpress