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HBM4E

Estable2 noticias2 fuentesÚltima actualización: 1 sa önce

Temas relacionadosAI SK hynix memory chip artificial intelligence Samsung Electronics SK하이닉스 메모리 고대역폭 메모리

Últimas noticias

SK hynix Ships Samples of New 12-Layer HBM4E Chip for AI Applications

Tecnología·1 sa önceResumen IA

SK hynix Ships Samples of New 12-Layer HBM4E Chip for AI Applications

SK hynix has begun shipping samples of its 12-layer HBM4E chip, designed for AI applications, to global customers. The new chip offers over 20% greater power efficiency than previous models, aiming to enhance AI training and inference workloads.

SK하이닉스, 차세대 AI 메모리 HBM4E 샘플 공급 시작

Tecnología·1 sa önceResumen IA

SK하이닉스, 차세대 AI 메모리 HBM4E 샘플 공급 시작

SK하이닉스가 차세대 AI 메모리인 HBM4E 12단 샘플 공급을 시작했다. 이전 세대 대비 성능과 전력 효율을 높였으며, 개선된 MR-MUF 공정으로 48GB 용량과 구조 안정성을 확보했다.