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Business·25/06/2026Résumé IA
JCET to Build Advanced Chip Packaging Plant in Shanghai's Lin-gang Area
JCET plans a 4 billion yuan advanced chip packaging and testing factory in Shanghai's Lin-gang Special Area, with the first phase completing by H2 2028. This move is crucial for China's chipmaking capabilities amid US export controls, driving a 147% surge in JCET's shares.
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