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Tecnología·02.06.2026Resumen IA
Samsung Electronics Unveils HBM5 Mock-up and Heat Management Technology at Computex 2026
Samsung Electronics revealed its first mock-up of 8th-generation High Bandwidth Memory (HBM5) at Computex 2026, showcasing its proprietary Heat Path Block (HPB) technology for advanced heat management. CTO Song Jae-hyuk emphasized the importance of total solution competitiveness in the AI era.
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