SK hynix to Hold Groundbreaking Ceremony for New U.S. Semiconductor Plant
Hızlı Bakış
SK hynix to invest $3.87B in Indiana's first U.S. advanced semiconductor packaging and R&D facility, hosting a groundbreaking ceremony on Aug 27, attended by key tech CEOs.
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SK hynix's investment is part of a broader trend in semiconductor manufacturing expansion in the U.S.
SEOUL, Aug. 12 (Yonhap) -- SK hynix Inc. will hold a formal groundbreaking ceremony for its new semiconductor packaging plant in the U.S. state of Indiana on Aug. 27, industry sources said Wednesday.
The South Korean chipmaker has announced plans to invest US$3.87 billion into its first U.S. advanced packaging and research and development (R&D) facility in West Lafayette, Indiana, to produce high bandwidth memory (HBM) chips for artificial intelligence (AI) applications.
SK hynix Chief Executive Officer (CEO) Kwak Noh-jung as well as a number of CEOs and officials from major technology companies are expected to attend the ceremony, according to the sources. SK Group Chairman Chey Tae-won may attend the event, with speculation that Nvidia Corp. CEO Jensen Huang could also join the ceremony.
SK hynix and Nvidia have been partners in global AI data center projects, as well as in the supply of memory chips and graphics processing units (GPUs). Chey and Huang have also held meetings frequently in South Korea and the United States since last year.
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Successful establishment of the facility will enhance SK hynix's global competitiveness in AI chip production.
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Açık Sorular
- Timeline for facility completion
- Expected job creation
