Minister of Industry: “Honam semiconductor cluster fab deployment will be completed within this month”

Regarding the Honam semiconductor cluster project, Minister of Trade, Industry and Energy Kim Jeong-kwan said on the 10th, "First of all, it is very important how companies place their fabs (semiconductor production facilities), and the details are scheduled to be finalized within this month."

When Democratic Party lawmaker Jo In-cheol asked about the future schedule of the Honam semiconductor cluster project at the plenary session of the National Assembly's Budget and Accounts Special Committee on this day, Minister Kim responded, "The overall situation has arrived very quickly. Various matters, including fab deployment, are moving diligently under the surface."

In particular, regarding the fab deployment, Minister Kim said, "I think it can be seen as a kind of starting point for everything else. How quickly the fab is completed with Yongin is closely related to whether or not it will have hegemony over the competitiveness of our country's semiconductor industry. Accordingly, it is expected that an industrial complex agreement will also be in progress."

Minister Kim also explained, "If we talk about visible results for local residents, there will be the relocation of the military airport and other things that will change the contents, and I think that the outline of the overall picture will be revealed at the end of this year, around 2027."

He added, “The (military) airport is divided into a part used as an airport and an ammunition depot, and it has been judged that construction is possible in some areas even before the airport is relocated, so we are reviewing construction in those areas.”

Minister Kim also asked Rep. Cho, "During recent discussions with companies, have any companies expressed their intention to withdraw their investment?" He responded, "Not at all, and companies are thinking about going as quickly as possible."