TSMC enters the 3D DRAM market? Winbond Electric Co., Ltd. Youjun: If you really want to do it, you won’t do it half-heartedly.

TSMC (2330) is rumored to produce 3D DRAM for Huida, entering the advanced memory market and attracting attention from the semiconductor industry. In this regard, memory factory Winbond (2344) chairman Jiao Youjun said today (7th) that TSMC is a company that pursues excellence and will not just do half-baked projects. If it is determined to invest, it should prepare quietly first and wait until the technology is mature before making it public.

Winbond held a Family Day at Janfushan World Theme Park today. During the interview, Jiao Youjun pointed out that if TSMC wants to enter the DRAM market, the first thing it faces is the problem of technology mastery. It must evaluate whether it is willing to invest corresponding funds and master the relevant technologies on its own. In addition, patent issues must also be dealt with when entering new fields, which cannot be accomplished by simply investing money.

Jiao Youjun believes that TSMC is a company that pursues excellence. If it really wants to do something, it will not only do half of it, nor will it release the news before the preparation is completed. If it really invests, it should wait until the technology has developed to a certain level before making it public.