It is rumored that TSMC will enter into 3D DRAM and plan and manufacture, evaluate and build a factory at the request of Huida

Technology media The Information reported today that TSMC is considering expanding its business territory and entering advanced memory chip manufacturing in order to gain a greater market share in the artificial intelligence (AI) hardware market.

The Information quoted two people familiar with the matter as saying that TSMC has recently begun planning an advanced memory chip manufacturing plan called 3D DRAM at the request of Nvidia.

TSMC and Huida have not yet responded to Reuters' requests for comment.

According to reports, TSMC may choose to build a new advanced memory chip factory, but it is unclear when production is expected to begin.

The report pointed out that the world's largest chipmaker is also evaluating acquiring existing factories and converting them into memory production facilities, similar to what Micron did this year when it acquired a wafer fab and converted it into a DRAM production facility.

Dynamic random access memory (DRAM) chips are used to temporarily store data in electronic devices. 3D DRAM is a memory architecture that increases capacity by stacking memory cells vertically instead of arranging them in a single horizontal layer.

According to reports, this plan is led by TSMC Deputy General Manager Xu Guojin, who is responsible for overseeing TSMC’s advanced packaging business.

As TSMC may enter the advanced memory market, the rapid development of AI has led to a serious shortage of memory chips, which has pushed up prices and prompted chip design companies to actively seek additional sources of supply.

If TSMC enters the advanced memory market, it will have to compete with companies such as Samsung Electronics, SK Hynix and Micron. (Compiled by: Xu Ruicheng) 1151107