MediaTek releases Dimensity 9600 Pro and M series chips, using TSMC’s 2nm process for the first time

MediaTek released the first flagship 5G Agentic AI chip using TSMC’s 2nm process - Dimensity 9600 Pro. (Provided by MediaTek)

[Reporter Zhuo Yijun/Taipei Report] MediaTek (2454), the leading IC design company, today officially released the Dimensity 9600 series of flagship 5G Agentic AI chips - Dimensity 9600 Pro and Dimensity 9600 M, Dimensity 9600 Pro is MediaTek's first flagship AI mobile chip using TSMC's (2330) 2nm process. It is the most powerful chip in the history of the Dimensity series, targeting the high-end market. Mobile phones equipped with Dimensity 9600 Pro will be available as soon as October. MediaTek's general manager and chief operating officer Chen Guanzhou said that MediaTek is fully embracing the AI era, relying on multiple growth engines from edge to cloud, integrating technology and ecological resources into a solid driving force to continue to promote Agentic The rapid development of the AI era has ushered in a new era of AI on smart devices with a fully evolved Agentic AI experience.

Xu Jingquan, senior deputy general manager of MediaTek, said that the Dimensity 9600 Pro, as the most powerful flagship AI mobile chip in the history of the Dimensity series, reshapes the definition of a flagship with a comprehensively innovative AI native architecture. It not only achieves a double leap in performance and energy efficiency, but also integrates the advanced technologies that Dimensity has broken through generations to create excellent Agentic for global users. As a new AI experience, Dimensity 9600M is born to popularize the flagship experience, allowing more users to enjoy the high-end smoothness and AI-empowered excellent experience, and enriching the diversified layout of the flagship market segment.

Dimensity 9600 Pro adopts a new AI native architecture design, using advanced TSMC 2nm process and TSMC Design-Technology Co-Optimization (DTCO) to achieve breakthrough performance and energy efficiency, and empower a new experience for Agentic AI mobile phones. Single-core performance is improved by 17% and multi-core performance by 15% compared with the previous generation. Multi-core power consumption is saved by 61% compared to the previous generation’s peak performance. Through in-depth collaboration between the new CPU and NPU, a powerful AI computing foundation is built. In addition, the chip also upgraded the Dimensity scheduling engine, which uses software and hardware collaboration to accurately schedule computing power, power and flash memory resources, helping mobile phone manufacturers create fast, power-saving systems and AI experiences that maintain background operation of multiple applications.

Dimensity 9600M adopts TSMC's 3nm process, integrates a powerful flagship-level computing core, and has the consistent high energy efficiency of the Dimensity series. Through the efficient collaboration of software and hardware of the imaging engine, Agentic AI engine 3.0, Dimensity scheduling engine, and Star Speed ​​engine, and integrating flagship-level multiple technologies, it brings users outstanding flagship experiences in gaming, imaging, AI, and communications.