
Beijing aims to challenge foreign tech standards by promoting a miniaturised version of its 20-year-old coding system for computer components.
China's SAMR has initiated the international standardisation process for 'Micro Han Xin', a miniaturised code designed to track ultra-small semiconductors and challenge foreign standards like Data Matrix.
AI-generated summary
China's original Han Xin code was created nearly 20 years ago. The domestic semiconductor sector heavily relies on foreign systems like Data Matrix.
China is attempting to breathe new life into its nearly 20-year-old Han Xin code by promoting a miniaturised version to use on semiconductors, marking the latest chapter in Beijing’s long-running attempt to secure a foothold for its home-grown standards in global industrial supply chains.
The State Administration for Market Regulation (SAMR) said on Monday that the “Micro Han Xin” code – a scaled-down iteration of the 2007-era symbology – had entered the formal international standardisation process. The effort aims to mark components that are too small for conventional labelling, specifically computer components.
These ultra-compact codes give unique identities to sensors, microprocessors, controllers, memory units and other components, allowing them to be tracked across complex fabrication, packaging and testing workflows.
The move reflects a strategic recalibration as China looks to challenge the established foreign technologies being used in high-specification industrial applications. The SAMR acknowledged how the domestic semiconductor sector currently relies heavily on foreign systems such as Data Matrix, which was created in the United States nearly 40 years ago and is already the global standard for marking and tracking semiconductors, silicon wafers and electronic components.
AI outlook — possibilities, not facts
Micro Han Xin code enters formal international standardisation process.
Very likely · Within months

China Electronics Industrial Basic Research Institute recently demonstrated its progress in the field of third-generation semiconductor silicon carbide. By building a complete product matrix, the institute has achieved large-scale development of silicon carbide products, and has in-depth layout of application scenarios such as new energy vehicles, new energy storage and computing infrastructure, to help integrate the digital economy and energy system.
The World Open Source Artificial Intelligence Competition (GOAI) concluded in Hangzhou. The competition attracted more than 14,000 developers from 91 countries and regions around the world to participate. In the end, the Chinese project "MirrorPeptidizer: DeNovo mirror peptide design algorithm" won the grand prize and a bonus of 1 million yuan.

Second-hand bookstores across Japan have experienced an unusually large purchase of books since August. An investigation found that overseas AI companies were suspected of large-scale acquisitions of books through automated systems, and more than 50 tons of Japanese books were shipped to the United States. They were feared to be used in AI model training and then destroyed, triggering concerns among the industry and the public about the loss of intellectual assets.

A planned supercomputing hub at Hong Kong's Northern Metropolis megadevelopment will begin phased operations in mid-2027, according to electricity supplier CLP Power.

Samsung reportedly plans to add safety chips to Galaxy mobile phone batteries, and the first wave may be introduced into the mid-range Galaxy A series. This uses VIA PUF's physically non-replicable function technology to create a unique digital ID card for each battery to confirm its authenticity, thereby improving battery safety.
On the 23rd, at the opening ceremony of the 2026 China International Information and Communications Exhibition, the ION-2030 (Intelligent Optical Network) Promotion Group was announced in Beijing. The promotion group is led by the China Academy of Information and Communications Technology and will focus on three aspects: pre-research on key technologies, industrial chain resilience and industrial application development scale.