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Tech·2d agoAI summary
AI推動先進封裝技術演進 面板級封裝成新戰場
AI需求爆發帶動先進封裝技術演進，面板級封裝（FOPLP）成為新戰場。台積電短期聚焦CoPoS，規劃2028下半年量產；長期則布局玻璃基板，預計2030年後量產。台灣面板廠具備大尺寸面板生產經驗，在FOPLP領域具備先發優勢，並與半導體廠形成互補。
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自由时报TrendForce
Steady6 stories3 sourcesLast updated: 2d ago
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Tech·5d agoAI summary
2026年第一季全球晶圓代工營收創新高，台積電市占率突破72%
2026年第一季，全球晶圓代工產業營收達479.5億美元，創歷史新高。台積電營收增長逾四成，市占率首度突破72%，幾乎獨占產業成長成果。三星、中芯國際等競爭對手成長有限，市場集中度進一步提高。
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Tech·6/11/2026AI summary
2026年第一季全球企業級SSD品牌營收創新高
2026年第一季全球前五大企業級SSD品牌營收創下新高，達184.6億美元，較前一季成長86.1%。受AI Agent普及與雲端服務供應商強勁訂單帶動，市場供需失衡，合約價狂飆80%。三星營收居冠，SK海力士、美光、鎧俠、SanDisk緊隨其後。
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Developing
Tech·6/10/2026AI summary
SpaceX's Mega-Listing to Boost Satellite Industry with Diverse Space Applications
SpaceX's planned IPO, seeking $75B at a $1.75T valuation, is expected to boost the satellite industry's growth, driven by expansions into direct-to-cell services, space-based solar power, AI computing, and vertical integration with its Terafab AI space computing chip facility.
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SCMP Tech
Developing
Tech·6/4/2026AI summary
Nvidia, MediaTek Enter AI PC Market, Poised to Reshape Landscape
Nvidia and MediaTek are launching the RTX Spark platform with N1/N1X processors, aiming to boost AI PC adoption. This move is expected to shift the market from basic NPU functions to advanced agent and local model computing, significantly increasing AI PC penetration by 2029.
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Tech·6/2/2026AI summary
HBM suppliers to gain leverage in price negotiations due to AI demand: TrendForce
HBM suppliers like Samsung, SK Hynix, and Micron are expected to gain pricing power due to surging AI demand and HBM's lower profitability compared to standard DRAM. TrendForce predicts contract prices could rise significantly next year as demand outstrips supply.
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