Samsung's 2-nano DeepX AI chip wins CES Innovation Award

DeepX, an artificial intelligence (AI) semiconductor company, announced on the 10th that its next-generation AI semiconductor 'DX-M2', which uses Samsung Electronics' [005930] 2-nano process, received the Innovation Award in the artificial intelligence category at 'CES 2027'.

DX-M2 is designed to directly run large-scale language models (LLMs) and vision language models (VLMs) on robots and industrial devices.

The development goal is to reduce dependency on the cloud by implementing generative AI inference on the device itself with about 5 watts (W) of power.

DeepX completed the tapeout of handing over chip design data to the foundry earlier this month.

We plan to secure the first prototype chip in March next year and supply samples for customer evaluation in the second quarter.

We plan to begin supplying initial mass production quantities in the fourth quarter of next year and begin full-scale mass production in 2028.

Previously, DeepX began mass production of the first generation product 'DX-M1' using Samsung Electronics' 5-nano process in August last year.

Meanwhile, DeepX also received innovation awards in three categories at CES 2024 and two categories at CES 2026.