Holley Enterprises completed the signing of a 6 billion yuan joint loan project to expand global high-tech layout

Huayin Vice Chairman Lin Zhiyan (front row, 3rd from right), on behalf of the United Loan Group, completed the signing of a 6 billion yuan joint loan project with Holley Chairman Zhang Zunxian (front row, 3rd from left). (Provided by Huayin)

[Reporter Chen Meiying/Taipei Report] In order to expand its global high-tech materials and equipment layout, Holley Enterprises has appointed China South Bank, Yushan Bank, Land Bank, Mega Bank and First Bank to jointly coordinate and sponsor the NT$6 billion joint loan project. The signing was completed today (8th). Participating banks also include Bank of Taiwan, SinoPac Bank and Taiwan Enterprise Bank. The joint loan project was successfully completed with the active participation of the bank group, which shows that financial institutions recognize Holley's management team, industry status and future development prospects.

Holley Enterprise has been established for more than half a century. It mainly focuses on high-tech fields such as semiconductors, PCB, optical communications and information communications, and provides materials and equipment integration services. In recent years, benefiting from the continued growth in demand for AI, high-performance computing (HPC) and advanced manufacturing processes, the company's operations and profit performance have hit new highs.

Holley said that in response to the rapid development of global AI and high-performance computing, the company continues to lay out business opportunities for advanced processes, advanced packaging and terminal computing power upgrades. In the field of AI servers, in addition to providing smart assembly automation solutions and gradually introducing new generation computing platforms such as NVIDIA, it has also entered the liquid cooling high-end rubber market in response to the trend of server cooling technology shifting from air cooling to liquid cooling.

In the PCB field, Holley continues to steadily supply high-end copper foil substrate (CCL) materials and assists customers in entering the US CSP new generation AI server motherboard supply chain; the semiconductor business continues to expand the overseas market of electronic-grade special gases, and the sales momentum of key process materials remains strong.

In addition, Holley is also actively developing the optical communication market, and high-end plastic materials have entered the new generation of high-speed transmission applications. The company stated that in the future, it will continue to leverage its advantages in material and equipment integration, deepen its global market layout, seize industry growth opportunities such as AI, high-performance computing, and high-speed transmission, and improve its overall operating performance.