
景碩科技(3189)於6日公告,以新台幣60億元(含稅)購入桃園市平鎮區延平路三段工業土地,面積約1萬5,122坪,將作為新廠建置用地,以應對AI、高效能運算及先進封裝需求帶動的高層數載板需求。瑞普國際物業董事長劉美華指出,超過1.5萬坪且具完整規劃條件的土地較為稀缺。景碩董事長廖賜政曾表示,AI已成為公司未來營運發展主軸,此次土地購買延續其2021年購入勝華科技幼獅廠的布局,顯示公司持續投入廠區資源以提前應對載板需求成長。
AI-generated summary
景碩科技為和碩集團旗下公司,主要從事載板製造。近年AI伺服器、高效能運算及先進封裝需求成長,帶動高層數載板需求增加。公司曾於2021年購入勝華科技幼獅廠,土地面積約2萬7,280坪,目前已成為重要製造基地。
和碩集團旗下景碩科技(3189)6日公告,以新台幣60億元(含稅)購入桃園市平鎮區延平路三段工業土地,面積約1萬5,122坪,將作為新廠建置用地,因應高層數載板需求。(圖/銳普萊坊提供)
AI、高效能運算需求持續升溫,半導體供應鏈擴充產能,帶動大型產業用地交易。和碩集團旗下景碩科技(3189)6日公告,以新台幣60億元(含稅)購入桃園市平鎮區延平路三段工業土地,面積約1萬5,122坪,將作為新廠建置用地,因應高層數載板需求。
瑞普國際物業董事長劉美華表示,市場上要找到超過1.5萬坪、又能完整規劃的基地並不容易。對科技製造業而言,廠區除了生產線,還須配置倉儲及後勤設施,大面積且具完整規劃條件的土地相當難得。
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景碩科技董事長廖賜政曾指出,近年AI伺服器、高效能運算及先進封裝需求快速成長,載板的重要性也隨之提高,成為推升晶片效能的關鍵環節。公司也在5月股東會中表示,AI已成為未來營運發展主軸,為因應高層數載板需求,將透過興建新廠支應產能。
回顧景碩過往布局,2021年曾以44.85億元買下勝華科技幼獅廠,土地面積約2萬7,280坪,目前已成為重要製造基地。此次再斥資60億元取得平鎮逾1.5萬坪土地,顯示公司持續投入廠區資源,提前為AI相關應用帶動的載板需求做準備。
劉美華分析,企業購置產業用地時,除了考量土地面積與開發彈性,也會評估供電穩定度、周邊人才及供應鏈條件。隨著科技製造業持續擴充產能,土地規模充足、產權完整,且能配合高規格生產需求的產業用地,將成為企業布局時的重要考量。
AI outlook — possibilities, not facts
景碩科技將於新廠完工後提升高層數載板產能
Very likely · Within months

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