Taiwan Sembcorp Chairman: Profits in the second half of the year are expected to be better than those in the first half, and business opportunities in the AI ​​era are optimistic

Taiwan Sembcorp Chairman Guo Wenbi. (Photo by reporter Hong Youfang)

[Reporter Hong Youfang/Hsinchu Report] Taiwan Sembcorp (3532), a major silicon wafer manufacturer, held a shareholders' meeting today (11th). Chairman Guo Wenbi said that in the first half of this year, due to the increase in depreciation and amortization expenses for the new plant, profits were not as good as expected. Looking forward to the second half of the year, facing the silicon wafer market The favorable environment for the overall improvement of the market is that both 8-inch and 12-inch silicon wafer fabs are currently at full production, and communication with customers to increase prices has received very positive responses. Taiwan Sembcorp is confident that the profit in the second half of this year is expected to be better than that in the first half, and the future operating outlook is even more optimistic.

As the demand for AI, high-performance computing (HPC) and advanced packaging grows rapidly, Guo Wenbi also pointed out that the company is actively promoting product transformation and upgrading strategies, by increasing the proportion of advanced process products, deploying high-end special specification silicon wafers, and deepening joint development with customers to seize new business opportunities brought by the AI ​​era.

Guo Wenbi said that increasing the sales proportion of advanced processes will help seize the high value-added market. Sembcorp continues to introduce the most advanced technology from its Japanese parent company SUMCO. In conjunction with the gradual increase in the production capacity of the new 12-inch factory, the sales proportion of advanced processes will significantly increase. Currently, the proportion of 12-inch production has reached more than 70%. At the same time, it is actively deploying HBM high-bandwidth memory and special specification wafers for advanced packaging, striving to seize the most explosive high-growth market in the AI ​​era.

He also said that AI advanced packaging technology has driven the rapid popularization of multi-wafer stacking applications, which has greatly increased the silicon wafer area required for a single chip. In addition to actively deploying interposers required for advanced packaging, Sembcorp also works closely with customers to develop the most advanced carrier wafers, silicon capacitors and other related products, and actively deploys special wafers for 3D packaging.

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