Applied Materials joins hands with Intel to accelerate AI chip manufacturing innovation

Applied Materials, a materials engineering solutions company for the semiconductor industry, announced today (7th) that it is working together with Intel (Intel) to combine Applied Materials’ Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley and the technical capabilities of Intel’s R&D Park in Hillsboro, Oregon, to shorten the time to market of advanced semiconductor technologies required to support AI computing, and jointly accelerate chip manufacturing innovation in next-generation transistors, interconnects and advanced packaging technologies.

Applied Materials President and CEO Gary. Gary Dickerson said that Applied Materials and Intel have had a deep cooperative relationship for decades. The two parties continue to break through the technical limits of materials engineering and jointly advance the semiconductor technology blueprint. Through the cooperation between the two teams at the EPIC Center, they will further deepen the partnership, accelerate innovation in transistors, interconnections and packaging technologies, and promote the future development of AI computing.

Intel CEO Chen Liwu said that the demand for AI computing has driven the industry's demand for major breakthroughs in performance, energy efficiency and packaging technology. Intel is committed to promoting these innovations and working closely with ecosystem partners. We look forward to further expanding our cooperation at the EPIC Center and accelerating the advancement of advanced technologies from laboratory research and development to mass production in the United States.

The teams of Applied Materials and Intel are jointly developing a new generation of materials, process technologies and component architectures for the advanced logic process nodes required for AI workloads, and will continue to promote related work at the EPIC center. The cooperation between the two parties covers technological innovations in front-end and back-end processes, including interconnect shrinkage technology. In addition, the two parties will also jointly develop advanced packaging technology for Foveros 3D stacking to support high-performance computing platforms designed for emerging agent-based AI workloads.