Samsung Electronics and AMD collaborate on next-generation semiconductor test infrastructure

Samsung Electronics is collaborating with American semiconductor company AMD to advance the next-generation semiconductor manufacturing test infrastructure.

According to the industry on the 11th, AMD unveiled its 6th generation 'EPYC Embedded 9006' series processor on the 10th (local time) and introduced a configuration combined with Samsung Electronics' memory and storage products.

Products proposed by AMD for cooperation included Samsung Electronics' DDR5 RDIMM·MRDIMM, PCIe 6th generation PM1763 solid state drive (SSD), and MD310, a memory expansion module based on Compute Express Link (CXL) 3.2.

AMD's new processor supports up to 256 cores, PCIe Gen 6, and CXL 3.1 connectivity, and provides up to 1.8x improved throughput compared to the previous generation.

The main applications are industrial environments that require high-performance computation, such as semiconductor automated test equipment (ATE), enterprise storage, and network security systems.

In particular, it controls the inspection of memory and storage devices in semiconductor test equipment and supports performing multiple tests simultaneously.

Samsung Electronics plans to secure the computational performance, memory bandwidth, and high-speed data processing capabilities necessary to verify the performance of next-generation memory and input/output devices through cooperation with AMD.

“As memory and input/output (I/O) technology advances, manufacturing test environments must respond to increasing performance and bandwidth requirements,” said Choi Jang-seok, executive director of the memory product planning team at Samsung Electronics. “We look forward to working with AMD to introduce these capabilities into our manufacturing test infrastructure.”