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BackGovernment notifies Semicon 2.0 scheme with Rs 1.27 lakh crore outlay
Government notifies Semicon 2.0 scheme with Rs 1.27 lakh crore outlay
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Economic Times57 minutes agoBusiness1 min readIndia

Government notifies Semicon 2.0 scheme with Rs 1.27 lakh crore outlay

The new scheme aims to build a sovereign semiconductor ecosystem through fiscal support across the entire value chain.

Quick Look

  • The Indian government has launched the Semicon 2.0 scheme, allocating Rs 1.27 lakh crore to bolster domestic chip manufacturing.
  • The initiative covers the entire semiconductor value chain, from design and fabrication to assembly and testing for strategic infrastructure.

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Why It Matters

The government has notified the Semicon 2.0 scheme to boost the chip manufacturing ecosystem in the country. It covers six segments including design, capital equipment, and fabrication.

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The government has notified the Semicon 2.0 scheme with an outlay of Rs 1.27 lakh crore to boost the chip manufacturing ecosystem in the country.

The scheme has been divided into six segments covering designing of chips by Indian firms, setting up units for capital equipment required for chip production, semiconductor fabs, chip assembly, packaging and testing, etc.

"The government has decided to provide ... sustained policy support to the semiconductor sector in India by notifying the Semicon 2.0 Scheme for the development of semiconductor design and manufacturing ecosystem in India.

"Semicon 2.0 provides fiscal support to various verticals across the complete value chain of the semiconductor industry, ranging from chip design, fabrication and packaging to various segments of the semiconductor ecosystem," the notification said.

The scheme will aim to build resilient, trusted, and sovereign semiconductor technologies by focusing on designing, development, and deployment of target segment technologies for the national strategic and critical infrastructure.

It will target local development of semiconductor Intellectual Property (IP) cores, Chips, System-on-Chips (SoCs), and modules for electronic products, as may be identified from time to time based on national importance and strategic priorities.

"To achieve this, building blocks will be developed, including standard IPs for various types of Compute, Memory, RF, Power, Networking, Sensors, etc.," the notification said.

Open Questions

  • What are the specific eligibility criteria for firms?
  • What is the timeline for fund disbursement?

Related Topics

This article was originally published by Economic Times.

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