Su Zhengang (7th from left), deputy chairman of the National Science Council, takes a photo with the 11 IC Taiwan Grand Challenge winning teams. (Provided by National Science Council)
[Reporter Wu Baixuan/Report from Taipei] Taiwan’s semiconductor advantages, in order to attract new innovative applications from around the world, the National Science Council held the fourth level of the "IC Taiwan Grand Challenge" (ICTGC) this year. A total of 209 teams participated, and 11 teams were selected to win the award, including teams from the United States, Japan, the United Kingdom, Germany, France, Israel and local teams, in order to link international innovative technologies with the specific results of the domestic semiconductor and information communications industry ecosystem.
The National Science Council participated in the Taipei International Computer Show (InnoVEX) 2026), and announced the results of the fourth tier of ICTGC; Su Zhengang, deputy chairman of the National Science Council, pointed out that the National Science Council will organize the ICTGC competition in 2024, with the goal of making good use of Taiwan’s semiconductor and information communications industry advantages to attract global IC design innovation, chip innovative application and system integration talents to Taiwan for cooperation; so far, it has attracted nearly 600 new startups from 56 countries to sign up, of which international startups account for more than 70%.
According to statistics from the National Science Council, the 11 award-winning teams this time come from the United States, Japan, the United Kingdom, Germany, France, Israel and the mainland. Their fields include: AI chip design, AI systems, hardware acceleration technology, generative applications, large language models, information security; electric vehicles, autonomous driving, smart cities, communications industry, wireless Man-machine; sustainable manufacturing, energy-saving innovation, new energy, etc., judging from the list of winners, it fully responds to the key needs of the AI industry chain from underlying chips and computing power infrastructure to the implementation of smart applications. Each team will also exhibit innovative technologies in the ICTGC theme pavilion to conduct technology matchmaking and business opportunities with domestic and foreign industries.
The National Science Council also exhibited the top three award-winning teams. Among them, TurboNext.ai, a team from Singapore, specializes in AI software optimization. Through ICTGC guidance, it has successfully connected with domestic IC design service manufacturers. It is expected to roll out verification chips in the third quarter of this year, and has completed POC verification, achieving 3 to 5 times accelerated results. It has also set up a research and development base in Hsinchu; American New Venture 3D Architech has the world's leading "3D microstructure liquid cooling" technology and can provide next-generation cooling solutions for AI servers. Through ICTGC coaching and assistance, it will conduct POC verification with micro-fluidic heat spreaders. After the verification is completed, it will simultaneously connect to domestic industry resources.
The National Science Council stated that the core spirit of the ICTGC is to "open the door to global scientific and technological talents and attract cooperation in Taiwan", allowing international innovative technologies to form a closer cooperation network with Taiwan's semiconductor and ICT industry advantages. It also hopes that all walks of life will "insight into the infinite possibilities of technological innovation and application" during the event, and jointly inject new momentum into the development of Taiwan's AI and semiconductor innovative applications.
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