SK Hynix presents next-generation AI memory technology at ‘OCP Global Summit’

SK Hynix announced on the 16th that it introduced memory technology for the next-generation artificial intelligence (AI) era at the 'OCP (Open Compute Project) Global Summit' held at the San Jose Convention Center in California, USA from the 12th to the 15th.

OCP Global Summit is an annual technology conference attended by IT, semiconductor, server, and data center companies from around the world. This year, infrastructure technology to support AI development was a hot topic.

SK Hynix divided the exhibition space into two, placing a 'memory section' in the front that introduces its current flagship products, and a 'system demo' section in the large space in the back to display memory solutions that will form the next-generation server ecosystem.

The system demo section introduced three solutions: CMM-DDR5, MARS, and CMM-Ax.

'CMM (CXL Memory Module)-DDR5' is a memory solution that improves resource utilization efficiency by sharing a memory pool that can be shared by multiple servers as needed based on the Compute Express Link (CXL) interface standard.

At this exhibition, the second-generation product (256GB) was unveiled based on CXL 3.2, which more than doubled the bandwidth of the previous generation and improved energy efficiency by about 30%.

MARS is a next-generation system that maximizes efficiency by integrating solutions from partner companies into one rack, focusing on memory. CMM-Ax is a solution that reduces the power and cost burden of data centers by performing calculations directly in memory.

In the presentation session held in conjunction with the exhibition, Kim Ho-sik, Vice President of SK Hynix Memory System Research, and development site staff introduced memory-centric server systems and major memory technology performance.

SK Hynix said, “We will continue technological innovation so that AI technology continues to develop, focusing on memory.”