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Back格羅方德簽20億美元協議 為台積電生產CoWoS關鍵元件
格羅方德簽20億美元協議 為台積電生產CoWoS關鍵元件
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自由时报1 hour agoTech1 min readChinaView translation

格羅方德簽20億美元協議 為台積電生產CoWoS關鍵元件

格羅方德台積電矽中介層

Quick Look

格羅方德與台積電簽訂價值20億美元的5年協議，將在紐約州馬爾他廠生產用於台積電CoWoS先進封裝的矽中介層，預計2028上半年產量提升，以應對AI晶片需求導致的先進封裝產能不足。

AI-generated summary

Why It Matters

先進封裝技術是AI晶片生產的關鍵環節，目前需求遠超供應，成為產能瓶頸。台積電的CoWoS技術為業界領先先進封裝方案。

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首次上稿 10-08 22:12

更新時間 10-09 05:52

格羅方德將為台積電生產先進封裝關鍵元件。（路透）

〔編譯魏國金／台北報導〕路透報導，格羅方德（GlobalFoundries）8日宣布，已與台積電達成一項價值20億美元（639.08億台幣）的協議，在其紐約廠為台積電生產用於連結人工智慧（AI）處理器與高頻寬記憶體（HBM）的關鍵元件。

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報導說，該元件稱為矽中介層（Silicon Interposer），位於先進AI封裝內的處理器與高頻寬記憶體下方，使其兩者高速傳輸資料。

根據該5年協議，格羅方德將擴大紐約州馬爾他（Malta）廠產能，為台積電CoWoS先進封裝生產相關元件。

格羅方德說，馬爾他廠預料將成為美國本土第一座，生產用於先進封裝技術的矽中介層工廠。

隨著先進封裝的需求持續成長，該協議為未來產能的擴張奠定基礎，預計2028上半年產量將開始提升。由於對先進封裝的需求已超越現有產能，該技術已成為AI晶片生產的主要限制。

一手掌握經濟脈動 點我訂閱自由財經Youtube頻道

What to Watch

AI outlook — possibilities, not facts

  • 2028上半年格羅方德馬爾他廠將開始提升矽中介層產量

    Likely · Within months

Open Questions

  • 格羅方德在馬爾他廠的具體投資金額是多少？
  • 該協議是否包含排他性條款？
  • 未來是否會擴大至其他先進封裝元件的生產？

Related Topics

格羅方德
Organizations台積電
Places紐約州馬爾他美國
Topics台積電矽中介層先進封裝CoWoSAI處理器高頻寬記憶體
This article was originally published by 自由时报.

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