
Foreign media revealed that Huida is interested in using Intel's Foveros advanced packaging technology, and may start related cooperation as soon as the second half of 2028.
AI-generated summary
TSMC currently leads the global advanced packaging market, while Intel is actively developing advanced packaging technologies such as Foveros.
TSMC currently maintains its leading position in the global advanced packaging market. However, foreign media revealed that Huida has announced its intention to use Intel's Foveros advanced packaging technology, and related cooperation may be launched as soon as the second half of 2028.
Technology media "Wccftech" reported that according to the latest opinion of GF Securities analyst Jeff Pu, Huida may use Intel Foveros technology in some AI chip back-end processes in the future. As Intel's 14A advanced process is expected to enter mass production in the second half of 2028, Huida may also introduce Intel's advanced packaging services at a similar time.
In fact, this is not the first time Huida has been rumored to consider using Intel technology. In January this year, relevant reports stated that Huida may use Intel's 18A or 14A process to process some non-core chip components in its next-generation Feynman architecture GPU products, but the main GPU computing chips will still rely on TSMC's advanced processes.
The focus of this news turns to Foveros packaging technology. Compared with the traditional method of connecting multiple chips side by side, Foveros adopts a 3D stacking design, which can vertically integrate different chips, helping to reduce the packaging area and improve data transmission efficiency and energy efficiency between chips.
With the rapid growth of global AI computing demand, advanced packaging has become an important competitive field in chip manufacturing. TSMC's CoWoS technology is currently an important packaging solution for high-performance AI chips, but the related production capacity continues to attract great attention from the market. If Huida adds Intel as a packaging partner in the future, in addition to allowing Intel to obtain more business opportunities, it may also disperse some packaging needs and relieve TSMC's production capacity pressure.
It is worth noting that Intel has been actively developing advanced packaging business in recent years, including technologies such as EMIB, EMIB-T and Foveros, and it has been previously reported that Google TPU may adopt its packaging solution. If it successfully breaks into Huida's AI chip supply chain, it will help enhance Intel's competitive position in the advanced packaging market.
AI outlook — possibilities, not facts
Huida will launch Intel advanced packaging cooperation as soon as the second half of 2028
Possible · Within months

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