The world's four largest semiconductor giants commit to using ASML's high numerical aperture EUV

TSMC, Samsung Electronics and SK Hynix all committed on the 8th to use ASML's high numerical aperture extreme ultraviolet (High-NA EUV) machine, known as the "dream exposure equipment", to meet the growing demand for advanced chips.

This EUV costs US$400 million (NT$12.374 billion) per unit. So far, together with Intel, which has received this machine from ASML, all four of the world's largest chip manufacturing giants will use this machine. Marco Pieters, Asmore's chief technology officer, said, "This is a major step in mass production manufacturing with high numerical aperture. This is an important milestone."

South Korea's BusinessKorea reported that Samsung Electronics and SK Hynix, the world's two largest memory giants, stated that they will use high numerical aperture EUV to mass-produce advanced DRAM from 2028, and will work together to establish a "12-inch photomask" ecosystem to lead a new generation of semiconductor process innovation and move towards the "next AI" era.

CNBC reported that TSMC said it will use the Esmore machine to manufacture advanced chips and expects the use of high numerical aperture EUV to increase as AI applications require increasingly complex transistor architectures.

Investors believe that the success of high numerical aperture EUV is crucial to Asmore's future growth, and its stock price is expected to continue its 120% rise last year.

Barclays reported on the 8th that the announcements by TSMC, Samsung Electronics and SK Hynix "should provide a clearer picture of the adoption prospects, which is the key to the debate." The report added that the news was "exciting."

Samsung, TSMC and SK Hynix have joined Intel as ASML’s high numerical aperture EUV customers. In July, Asmore said Intel was using high numerical aperture EUV technology to produce advanced chips.

Asmore's recent financial forecast did not give a sales forecast, but said that it will increase 30% of its production capacity for EUV in 2027. Analysts at Barclays said, "We see that ASML is facing an important decision, that is, whether to further expand EUV production capacity on the recently announced expansion target, and demand is obviously strong."

TSMC, Samsung, SK Hynix and Intel have also joined ASML in promoting the development of next-generation 12-inch photomasks to replace the current 6-inch photomasks. ASML believes that this development will increase the production capacity of high numerical aperture EUV by 40% and simplify the design process.