
AI-generated summary
As the demand for AI semiconductors explodes, the wafer foundry 2.0 market grows rapidly, and TSMC leads its competitors with its advanced process and packaging technology.
First submission 09-30 23:29
Update time 10-01 06:32
TSMC ranks first in the foundry 2.0 market with a market share of 42%. (Reuters)
[Compiled by Wei Guojin/Taipei Report] In view of the explosive growth of global demand for artificial intelligence (AI) semiconductors, the "wafer foundry 2.0" market covering the entire semiconductor manufacturing ecosystem has also grown rapidly. As the market size hits record highs, TSMC's leading position is obviously further consolidated. Analysts pointed out that as AI semiconductor production expands from advanced processes to advanced packaging, TSMC is rapidly seizing the benefits of market growth.
South Korea's "BusinessKorea" reported that market research company Counterpoint Research announced on the 30th that the global OEM 2.0 market revenue in the second quarter of this year reached US$96.6 billion, an increase of 25% from the same period last year, setting a record high. In this quarter alone, market revenue increased by more than US$10 billion from US$86 billion in the first quarter.
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As the market expands, TSMC's influence also expands. TSMC’s global foundry 2.0 market share increased to 42% from 38% in the first quarter. During the same period, Samsung Electronics’ market share remained at 4%.
TSMC’s growth in the first quarter is also very eye-catching. Compared with the same period last year, its revenue increased by 41%. Analysts believe that this is due to the expansion of demand for TSMC's advanced processes and advanced packaging, driven by the growth in demand for AI graphics processors (GPUs) and application-specific integrated circuits (ASICs).
Foundry 2.0 treats the entire semiconductor manufacturing ecosystem as a single market, which includes not only pure foundry companies, but also non-memory integrated component manufacturers (IDMs), outsourced semiconductor packaging and testing (OSAT) companies and photomask suppliers.
As the demand for AI GPUs and ASICs grows, the utilization of advanced processes and advanced packaging is also increasing.
According to the report, although the foundry market continues to grow due to the expansion of demand for AI semiconductors, the competitive landscape is clearly consolidating, with TSMC taking a dominant position. This is because as the market for AI semiconductors expands, it becomes increasingly important to ensure advanced processes, large-scale production capacity, and advanced packaging.
Based on its leading position in the foundry market, TSMC has also accelerated its expansion of production capacity. It is rumored that TSMC is considering building its second US wafer fab park in Dallas, Texas, after Arizona.
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TSMC will officially announce the construction of a second U.S. wafer fab in Dallas, Texas in the coming months
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