Jingmai signed a production capacity outsourcing agreement with TSMC for more than 7 years! Issuing 15 billion bonds to build Zhongke Factory and mass production in 2029

Semiconductor packaging and testing factory Jingmao (3374) announced today (13th) that the board of directors decided to sign a seven-year capacity outsourcing agreement with TSMC (2330) to deepen the long-term strategic partnership. The two parties will cooperate in advanced packaging back-end processes. Jingcai plans to issue bonds to raise 15 billion yuan to build a production line at TSMC's Zhongke Factory. Jingcai will be responsible for production and related operations. The first phase of the production line is planned to be mass-produced in 2029.

Jingcai said that this cooperation is mainly to deepen the long-term strategic partnership with TSMC and jointly meet the strong production capacity demand of global high-performance computing (HPC) chips. With the rapid popularization of AI, HPC and data center applications, the market demand for advanced packaging technology production capacity has shown structural growth. With the support of TSMC, Jingcai will invest in capital expenditures such as production equipment and automatic material handling systems (AMHS), and will be responsible for manufacturing and production line operations.

Jingcai pointed out that it will combine its own packaging and testing operation experience, with the support of TSMC's advanced packaging technology and manufacturing capabilities, to ensure that the technical specifications, quality and yield of the new production line meet the requirements of TSMC and the world's top customers, becoming a new force in OS modules in the advanced packaging supply chain. The period of the capacity outsourcing agreement between the two parties is from November 13, 2026 to December 31, 2033.

In addition, the board of directors of Jingcai also approved the issuance of NT$15 billion in convertible corporate bonds to meet the initial production capacity construction needs.