Taiwanese company starts construction of AI computing power high-end electronic substrate materials R&D and manufacturing headquarters in Wuxi, Jiangsu

China News Service, Wuxi, November 6 (Sun Quan, Tang Juan) The Lianmao Electronics AI computing power high-end electronic substrate material R&D and manufacturing headquarters project (referred to as the "Project"), with a total investment of US$800 million, started construction in Wuxi Xishan Economic and Technological Development Zone on the 6th.

Lianmao (Wuxi) Electronic Technology was established in 2002 with investment from Taiwan Lianmao Electronics. It is mainly engaged in the research and development and production of printed circuit board substrates (CCL). Its products include high-end copper foil substrates, multi-layer laminate circuit core boards, prepregs, etc., which are widely used in mobile phones, new energy vehicles and other fields.

Currently, the Lianmao (Wuxi) electronic technology production line is operating at full capacity, with revenue of 2.894 billion yuan from January to September this year, a year-on-year increase of 25.4%.

With the rapid development of artificial intelligence and high-performance computing, global demand for AI computing power has surged, and demand for high-end copper-clad laminates has continued to rise. Related products have become core materials for leading global technology manufacturers. Based on the industry trends, Lianmao Electronics has expanded its layout in Xishan, Wuxi. The project started this time integrates R&D and design, intelligent manufacturing, testing and certification. After reaching full production, the annual revenue is expected to exceed 10 billion yuan (RMB, the same below).

Cai Xinxing, CEO of Lianmao Electronics Co., Ltd., said that the company has been deeply involved in Xishan for 24 years and has benefited from the local complete industrial chain ecology, precise government services and an open pattern for high-end manufacturing, and finally chose to land the project here.

At the 2026 Wuxi Xishan Golden Autumn Investment Cooperation Symposium held in the afternoon of the same day, Cai Xinzhen also proposed three major cooperation intentions to the merchant representatives on site: First, to strengthen the chain and invite enterprises in AI computing power, electronic components, high-end copper foil, intelligent equipment and other fields to jointly build The second is joint innovation, linking upstream and downstream partners, and scientific research institutes to tackle key technologies such as ultra-low loss base material formulation and high-precision lamination; the third is teaming up to expand the market, relying on Lianmao Electronics' global sales network, and working together to share the trillion-level market dividends of the AI industry.