Vice Chairman Ha Jung-woo visited the Samsung Semiconductor booth and said, “Confirmation of AI semiconductor roadmap” (comprehensive)

‘SEDEX 2026’ held... Samsung Electronics exhibits advanced packaging and next-generation memory

(Seoul = Yonhap News) Reporter Kim Min-ji and Kang Tae-woo = Vice Chairman Ha Jeong-woo of the National AI Strategy Committee visited Samsung Electronics' booth at the '28th Semiconductor Expo' (SEDEX 2026) held at COEX in Seoul on the 14th and said, "As the global number one company in the semiconductor industry, we were able to confirm the roadmap for how we can develop in the future by connecting AI and semiconductors."

Vice Chairman Ha stayed at the Samsung Electronics booth for about 10 minutes and asked various questions about Samsung Electronics' 'zHBM', foundry (semiconductor consignment production) technology and status, etc. We also inspected the progress of investment in the Yongin Semiconductor Cluster National Industrial Complex.

He said, “I confirmed how much Samsung Electronics products are contributing in the field of physical AI.”

About 300 companies from across the semiconductor industry, including memory, system semiconductors, materials, components, and equipment, will participate in this exhibition, hosted by the Korea Semiconductor Industry Association.

Samsung Electronics participated from the 14th to the 16th and prepared six exhibition spaces under the theme of 'AI system design', including next-generation technology, cloud AI, edge AI, physical AI, semiconductor cluster, and win-win cooperation.

In particular, it introduced semiconductor technology capabilities encompassing memory, foundry (semiconductor consignment production), system LSI, and advanced packaging.

In the memory field, Samsung Electronics exhibited HBM4E (7th generation), the next-generation high-bandwidth memory (HBM), and LPDDR-PIM, which integrates calculation functions inside the memory. In addition, models of 'zHBM', a three-dimensional (3D) memory technology that reduces the physical distance between computing devices and memory, and 'zNAND-O', a 3D NAND solution optimized for edge AI, were also unveiled.

The foundry introduced the 4-nano process-based HBM4E base die and advanced packaging technologies '2.3D Cube-E', '3D Cube-H', and 2-nano Gate All Around (GAA) wafers.

System LSI exhibited 'DIMM Solution', which integrates the core chips required for server memory modules, 'Isocell HPC', a 200 million pixel image sensor, and 'Exynos 2600', a mobile processor.

Samsung Electronics will also introduce its major production and development bases and plans to create the Yongin National Industrial Complex in the semiconductor cluster zone newly established this year. Samsung Electronics plans to invest approximately 360 trillion won in the Yongin National Industrial Complex, and aims to begin site development and construction in 2027 and operate its first production line in October 2029.

About 70 materials, parts, equipment, and fabless companies will move into the industrial complex, creating a semiconductor ecosystem that links manufacturing, research and development, and partners.