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BackCentral University was selected into the National Science Council's Silicon Photonics Forward-looking Technology R&D and Application Program and will integrate its cross-field advantages to develop key technologies for high-speed optical connections in the AI era.
Central University was selected into the National Science Council's Silicon Photonics Forward-looking Technology R&D and Application Program and will integrate its cross-field advantages to develop key technologies for high-speed optical connections in the AI era.
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自由时报47 minutes agoTech2 min readChinaView original

Central University was selected into the National Science Council's Silicon Photonics Forward-looking Technology R&D and Application Program and will integrate its cross-field advantages to develop key technologies for high-speed optical connections in the AI era.

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  • Central University was selected into the National Science Council's Silicon Photonics Forward Technology Research and Development and Application Program, becoming one of the five selected universities in the country.
  • The school will integrate its research strengths in optical engineering, thin film lithium niobate modulation elements and optical communications, carry out cross-field integration for optical alignment, precision measurement, modulation elements and waveguide materials, develop key technologies for high-speed multi-channel optical connections, and actively expand domestic and foreign cooperation to help break through the bottleneck of AI chip computing and data transmission.

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Why It Matters

Central University was selected into the National Science Council's Silicon Photonics Forward Technology Research and Development and Application Program, becoming one of the five selected universities in the country. The project aims to develop key silicon photonics technologies to meet the needs of high-speed data transmission in the AI ​​era.

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Xiao Shusan (third from right), President of Central University, affirms the strong strength of the silicon photonics research team of Central University and looks forward to actively expanding cooperation at home and abroad in the future. (Photo courtesy of Central University)

Attack forward-looking technology! Central University was selected into the "Silicon Photonics Forward-looking Technology R&D and Application Program" of the National Science Council, ranking among the five selected universities in the country. The school stated that it will integrate the country's leading research advantages in optical engineering, thin film lithium niobate modulation elements and optical communications to seize the leadership advantage in key technologies for high-speed multi-channel optical connections in the AI ​​era.

The project is hosted by Chen Qichang, professor of the Department of Optoelectronics of National Central University. He said that one of the biggest features of the project is to introduce the optical engineering technology accumulated by CUHK into silicon photonics and advanced packaging. The optical team led by Professor Sun Qingcheng of the Department of Optoelectronics will use free-space optical alignment technology to solve the problem of precise alignment between optical fibers and tiny waveguides, and develop advanced optical coupling processes and system architectures. The team also has nanometer-level three-dimensional real-time detection capabilities and will establish a precision measurement mechanism for advanced packaging.

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In terms of high-speed transmission components, the team led by Professor Chen Yanhong of the Department of Optoelectronics has long been engaged in research on thin-film lithium niobate modulation components with high-speed electro-optical modulation properties. It is an important technology for the next generation of ultra-high-speed signal transmission and photonic integrated circuits, and will also become a key link in the silicon photonics R&D layout. In addition, Chen Shenghui, director of the Optoelectronics Research Center, continues to integrate basic research equipment on campus and invests in the research of high-refractive index silicon photonic waveguide materials, moving towards component miniaturization and improving system integration. From optical alignment, precision measurement, modulation components to waveguide materials, the school has gradually built complete silicon photonics research and development capabilities through cross-field integration.

Sun Qingcheng pointed out that the computing speed of AI chips continues to increase, but data transmission between chips and subsystems has gradually become a bottleneck. Taiwan has a complete industrial ecosystem in chip manufacturing and AI server equipment. If it further combines optical connections and advanced packaging, it is expected to establish a new industrial cluster. CUHK will leverage its advantages in optical engineering, delve into silicon photonics and common optical packaging technologies, and assist in breakthroughs in key technologies.

Xiao Shusan, president of National Central University, said that silicon photonics is an important direction in the current international technological development and is highly relevant to Taiwan's semiconductor industry. The school will fully support the establishment of silicon photonics basic research and development equipment and actively expand domestic and foreign cooperation. CUHK has long accumulated research energy in the fields of optoelectronics, electrical machinery, physics, quantum and space technology. It will integrate cross-department research teams and establish closer cooperative relationships with industries and research institutions to develop silicon photonics research with CUHK characteristics.

What to Watch

AI outlook — possibilities, not facts

  • Central University will develop advanced optical coupling processes and system architectures through cross-disciplinary integration of optical engineering, thin film lithium niobate modulation elements and high refractive index silicon photonic waveguide research.

    Likely · Within months

  • Central University will actively expand cooperation at home and abroad, delve into silicon photonics and common optical packaging technology, and help break through the bottleneck of AI chip computing and data transmission.

    Likely · Within months

Open Questions

  • What is the specific funding amount for this project?
  • When is the key technological breakthrough expected to be completed?
  • Which domestic and foreign industries or research institutions will you specifically cooperate with?
  • What are the specific implementation paths for advanced packaging technology?

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This article was originally published by 自由时报.

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