Hon Hai and Intel signed a strategic cooperation memorandum to jointly promote AI cabinets, edge AI and physical AI

Hon Hai Chairman Liu Yangwei (from left) and Intel CEO Chen Liwu signed a strategic cooperation memorandum. (Provided by Hon Hai)

[Reporter Fang Weijie/Taipei Report] Hon Hai (2317) Chairman Liu Yangwei met with Intel CEO Chen Liwu today. The two parties signed a Memorandum of Strategic Cooperation (MoU) to formally establish a strategic partnership. Combining Intel's technical advantages in processors, silicon photonics and software ecosystem, and Hon Hai's global manufacturing, system integration and AI data center deployment capabilities, jointly promote AI cabinets, edge AI (Edge AI) and physical AI (Physical AI) AI) and other next-generation platforms are developed to lay out application markets such as robots, smart manufacturing, smart cities and vehicles.

Hon Hai is optimistic that as the AI ​​industry gradually moves from large-scale model training to real-world applications, physical AI has become the latest focus of competition in the technology industry. Chairman Liu Yangwei said that AI is rapidly reshaping global industrial and social operating models. With the "3+3+3" strategy, the group is actively deploying core technologies such as AI, semiconductors and next-generation communications, and promoting the development of the three major platforms of smart manufacturing, smart electric vehicles and smart cities.

Liu Yangwei said that this cooperation between Hon Hai and Intel will integrate the advantages of both parties in computing platforms, system integration and global supply chains to jointly build a new generation of AI infrastructure, jointly build edge AI and physical AI ecosystems, and accelerate the implementation of AI applications.

Intel CEO Chen Liwu said that AI is growing rapidly, especially the rise of large-scale inference and agent AI (Agentic AI) workloads, which are redefining the needs of modern computing architecture. Future AI development will not only rely on next-generation chip design, but also require support from rack-level systems, edge AI, and physical AI deployment capabilities. Intel and Hon Hai will jointly promote end-to-end platform development and expand the influence of AI technology in the global market.

According to the cooperation content, the two parties will prioritize the AI ​​rack infrastructure market and jointly explore the development and commercialization of rack-level AI solutions, covering rack and AI accelerator architectures with Intel Xeon processors as the core. They will also promote key technologies such as high-speed interconnection, liquid cooling, system monitoring, and data center expansion to improve AI data center performance and energy efficiency.

The two parties will also jointly define the next generation edge AI and physical AI platform architecture, lay out the application directions of agent AI, terminal intelligence and robots, and further promote the implementation of smart factories, smart cities, vehicles and robots and other diverse fields. At the same time, we will explore design service cooperation opportunities such as customized ASIC (application-specific chip), SoC (system-on-chip) and system integration, and combine Intel chip technology with Hon Hai’s design and manufacturing service capabilities to further expand global AI market business opportunities.

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