Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)'s advanced packaging plant under construction in Chiayi Science Park was photographed on September 8. Photo: Lin Yichang, Taipei Times
Rapid expansion: TSMC plans to increase investment by building five more advanced packaging plants in the Chiayi Science Park, according to reports.
By Chen Zhenghui/Staff Reporter
Please read on...
The National Science and Technology Commission has issued a formal announcement soliciting public opinion on the further expansion of the second phase of the Chiayi Science Park (Chiayi Science Park), which local industry sees as the starting point for the park's third phase of development.
Chiayi Science Park is located in Taibao City, this county. Its development will be connected with other southern science park branches, including Tainan, Kaohsiung and Pingtung counties, as well as the Central Science Park and Hsinchu Science Park, to form the world's most complete artificial intelligence (AI) and semiconductor industry corridor, the association said earlier.
Taiwan Semiconductor Manufacturing Co. (TSMC, Taiwan Semiconductor Manufacturing Co.) plans to increase investment by building five more advanced packaging plants in the Chiayi Science Park, TSMC's sister newspaper Liberty Times reported yesterday, citing semiconductor supply chain sources.
If realized, TSMC's total number of advanced packaging plants in the park will reach ten, making it the world's largest and most technologically advanced packaging center, the report said.
TSMC currently has two advanced packaging facilities in the first phase of the park. The company started mass production in the first phase in June and has installed equipment in the second phase, the report said.
In the second phase, TSMC plans to build three packaging plants, and the third phase is already under construction. The company aims to complete construction of all three facilities in the second phase by 2031, the report said.
As for the third phase site, with an estimated area of 198.65 hectares and mainly leased from Taiwan Sugar Corporation (Taiwan Sugar), the association stated that the development will focus on technologies related to AI, heterogeneous packaging, silicon photonics, high-speed broadband networks, quantum technology and net-zero emissions.
The site will undergo a one-month public consultation period to gather views from the local community and all walks of life. After that, feasibility assessment and planning will be conducted and submitted to the Executive Yuan for approval before entering the urban planning and environmental impact assessment stages, the association said.
Strong demand for TSMC's on-wafer packaging technology from Inventec, Advanced Micro Devices and Apple is the main driving force behind TSMC's continued expansion of production capacity at the Chiayi Science Park, the report said, citing industry observers.
The third phase of investment will help transform the county into a global production center for advanced semiconductor packaging, the report said.
In July, TSMC raised its capital spending forecast for this year to $60 billion to $64 billion, up from the $52 billion to $56 billion range announced in April.
In addition to TSMC's investments in the United States, Japan and Germany, the company currently has 19 advanced wafer fabs and chip packaging plants in Taiwan and is building 13 additional wafer fabs and packaging facilities in Hsinchu City, Taichung City, Chiayi County, Tainan City and Kaohsiung City, according to the Ministry of Economic Affairs.
Further investments are being planned as TSMC seeks to maintain its lead over global competitors in advanced process development, the ministry said.
News source: Taipei Times
No need to draw, no need to grab. Now use the APP to read the news. You are guaranteed to win every day. Click me to download the APP. Click me to see the event details.
