Taiwan Semiconductor Manufacturing Co vice president of advanced packaging technology and service Jun He speaks at a 3D IC global summit in Taipei on Tuesday. Photo: CNA
EXPANSION:The 3-hectare site would include small clean rooms and laboratories as well as a world-class training base for advanced packaging talent, the company said
Staff writer, with CNA and AFP
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Taiwan Semiconductor Manufacturing Co （TSMC, 台積電） is to establish a presence in the Baipu Industrial Park （白埔產業園區） in Kaohsiung to accelerate the testing and validation of semiconductor materials and equipment, a company executive said on Tuesday.
The company is working with the Ministry of Economic Affairs and the Kaohsiung City Government on the plan, which is expected to improve validation efficiency by 25 to 50 percent, TSMC vice president of advanced packaging technology and service Jun He （何軍） said at a 3D IC global summit held ahead of the Semicon Taiwan trade show, which opened in Taipei yesterday.
TSMC would also conduct process research and development at the park with the aim of building a world-class training base for advanced packaging talent and connecting local suppliers with global supply chains, He said.
The company is planning to develop a 3-hectare site in the Baipu Industrial Park that would include two buildings featuring modular facilities that can be reconfigured as technology evolves, he said.
The site would include small clean rooms and laboratories for testing and joint development involving advanced packaging technologies, equipment and materials, he said.
The move comes as demand for advanced packaging has surged amid the rapid growth of artificial intelligence （AI） applications, he said.
Given that demand, TSMC expects its chip-on-wafer-on-substrate advanced packaging capacity to grow at a compound annual growth rate of more than 80 percent through next year, with growth expected to remain robust through 2029, He said.
Driven by skyrocketing demand for AI technology, revenue from Taiwan’s semiconductor industry is expected to increase by 40 percent this year, Taiwan Semiconductor Industry Association （台灣半導體產業協會） president Wu Chih-i （吳志毅） said yesterday.
“We are in a new era of the semiconductor industry from a technology point of view,” Wu said at the opening of Semicon Taiwan, adding that AI has pushed the development of new technology.
“This year Taiwan’s semiconductor industry has performed even better. Our total revenue is projected to be close to US$300 billion. That’s more than 40 percent growth over last year,” he said.
However, energy supply, talent and cybersecurity were “becoming more critical” for the industry and “no single country” could dominate the chip supply chain, he added.
“Continuous progress will require even closer semiconductor collaboration between many countries,” Wu said.
Also attending the event, SEMI president and chief executive officer Ajit Manocha said that global semiconductor revenue could reach US$2 trillion by 2030, as AI advances from training to inference and demand would grow for memory, higher bandwidth, advanced packaging and silicon photonics, creating new opportunities across the semiconductor ecosystem.
This would be the decade of AI, Manocha said, adding that the world is in the “early innings” and there would be “a lot more challenges” with the technology.
“It’s not going to be a straight line,” he said. “We’re going to have to learn how to deal with and navigate through the new opportunities and new headwinds.”
新聞來源：TAIPEI TIMES
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