The new generation of smart terminals is booming, and the industry is taking advantage of the momentum to consolidate the industrial base.

China News Service, Shanghai, October 28 (Reporters Zheng Yingying and Liu Liang) At the just-concluded 2026 Global Developers Pioneer Conference and International Embodied Intelligent Skills Competition, the focus was on embodied intelligent robots, a new generation of intelligent terminals. Shanghai set up a stage to gather more than 800 participating teams for "real machine combat" to accelerate its deployment in real scenarios.

With the evolution of artificial intelligence technology, the development of new generation intelligent terminals such as intelligent connected cars, artificial intelligence mobile phones and computers, intelligent robots, smart homes, and smart wearables has attracted much attention.

Official data shows that in 2025, China’s annual shipments of AI mobile phones, AI computers and other smart terminals will exceed 100 million units.

According to the "15th Five-Year Plan for the Development of Strategic Emerging Industries in Shanghai" released in August this year, Shanghai plans to build new artificial intelligence consumer terminals such as AI computers, AI mobile phones, AI glasses, bionic robots and smart wearable devices.

Xiang Xiang, vice president of Huawei and director of the Wireless Network Business Management Committee, said that the mobile communications industry is ushering in a new era of intelligence. The booming development of intelligent terminals and intelligent applications has brought new opportunities for industry growth and also put forward new requirements for new generation communication networks.

The booming development of the intelligent terminal industry also calls for stronger underlying computing power support. Many domestic computing power companies also continue to make breakthroughs in relevant technologies and optimize the supply of computing power.

In July this year, Oriental Computer Core released its first high-power computing chip DF1000 in Shanghai, exploring the third path in the chip field through "software-defined chip + 3D stacked near-memory computing" technology.

At the 26th China International Industrial Expo held in Shanghai from the 12th to the 16th of this month, Tianshu Zhixin presented its first solution in the systematic supernode layout - Tiangai 300 IXL144 supernode.

Super nodes use high-speed interconnection technology to integrate a large number of chips into a huge "computing power pool." Shan Tianyi, head of Tianshu Zhixin's AI and accelerated computing, said in an interview in Shanghai on the 28th that super nodes are not simply piecing together chips, but making them an organic whole that can work collaboratively.

Shan Tianyi also said that with the development of artificial intelligence, the capability of one chip can no longer meet all loads, and the combination of multiple computing paradigms is more important.