Bizlian-KY (3665), a major connection harness manufacturer, is optimistic about its operating prospects in 2027. Chairman Liang Huazhe pointed out at a conference today that the main growth momentum next year will still come from high-performance computing (HPC), especially artificial intelligence (AI)-related businesses. Demand for semiconductor equipment and other markets is also strong, and he maintains a highly optimistic view of operations in 2027.
BizLink pointed out that benefiting from continued investment in AI infrastructure, HPC business revenue increased by 77% year-on-year in the first nine months of this year, of which the power connection business increased by 97% year-on-year, and the data connection business increased by 49% year-on-year. As the power of AI computing systems continues to increase, customers' requirements for power transmission, bandwidth and signal integrity have increased simultaneously, driving demand for related products. BizLink has also continued to promote the generational transformation of copper wire and optical interconnect products.
In terms of optical communications, Florian Hettich, chief operating officer of Bizlian, pointed out that the optical business of Xinfusheng has more than doubled its monthly revenue since January this year, and its profitability has improved simultaneously. The company has successively demonstrated optical interconnect solutions, co-packaged optical (CPO) switch trays and 12.8T XPO transceivers at OFC, Computex and OCP this year, and continues to develop micro-vertical resonant cavity surface-emitting laser (VCSEL) technology to expand the next-generation optical interconnect layout.
In terms of merger and acquisition benefits, Singapore Interplex, which was newly acquired by BizLink, only had 7 days of operation in the third quarter and was included in the consolidated financial report. October was the first full merger month, with monthly revenue reaching US$67 million. The initial operating performance was better than the expected performance at the time of the acquisition. In the future, the Group will combine Interplex's precision mechanical engineering, chassis and subsystem integration capabilities with existing power and optical connection technologies to expand the market layout of AI cabinet infrastructure.
Deng Jianhua, general manager of BizLink, said that as the architecture of AI cabinets becomes increasingly complex, power transmission, data connection, mechanical structure and cooling systems need to be more closely integrated. The company will focus on differentiated components, assemblies and specific subsystems to increase its involvement in customer products. BizLink is also actively developing products such as high-current power distribution, cold plates, manifolds, liquid-cooling connections and leakage detection required for fully liquid-cooled AI cabinets.
In terms of semiconductor equipment, BizLink’s semiconductor production equipment (SPE) business revenue increased by 48% year-on-year in the first nine months of this year, and its growth rate exceeded the overall wafer manufacturing equipment market. Deng Jianhua pointed out that many customers still have strong expectations for equipment investment in 2030 and beyond, and the company will continue to expand manufacturing capabilities and strive for more complex equipment assembly and subsystem business.
Observing market uncertainties, Deng Jianhua believes that HPC is a long-term investment cycle, and deployment restrictions such as power supply, network and computer room facilities may affect customer deployment schedules. Liang Huazhe pointed out that although raw material prices have increased, interconnection solutions currently do not face major material shortages. BizLink will continue to promote new high value-added projects to maintain revenue growth and profitability.
