TPCA Show 2026 will be held on the 20th of this month. Taiwan’s PCB heavyweights are rare to come together to talk about prospects.

The largest PCB exhibition - TPCA Show will be on October 20th. (Taken from the official website)

[Reporter Zhuo Yijun/Taipei Report] With the explosion of AI computing power triggering hardware architecture innovation, Taiwan's PCB industry has taken off rapidly, ushering in a boom that is rare in a century. The Taiwan Circuit Board Association (TPCA) annual event "The 27th Taiwan Circuit Board Industry International Exhibition (TPCA Show)" 2026)" will be held at the Nangang Exhibition Center Hall 1 from October 20 to 22. The scale has reached a record high. Heavyweights in Taiwan's PCB industry have gathered together, including Chairman of Xinxing Jian Shanjie, Chairman of Zhending Group Shen Qingfang, TPCA Chairman Zhang Yuanming (Chairman of Yaohua), Lianmao Chairman Chen Jincai, Chisheng General Manager Liang Youwen and others will express their latest developments and prospects for the PCB industry.

TPCA stated that this year’s TPCA Show brings together more than 680 international brands and more than 1,840 booths, and is expected to attract 70,000 professional buyers from around the world to present the best solutions of “AI × PCB × advanced packaging” in an all-round way. The opening ceremony and keynote speech on the first day of the exhibition was given by Xinxing Chairman and Chief Strategy Officer Jian Shanjie, with the theme "Taiwan PCB Industry in the Era of Heterogeneous Integration: From Supply Chain to Ecosystem", revealing the transformation and layout blueprint of Taiwanese manufacturers in the AI ​​era.

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The Leaders Summit also has a strong lineup, with Phison Chief Technology Officer Lin Wei, Xinxing Executive General Manager Lan Ting, Zhisheng General Manager Liang Youwen and Prismark Managing Partner Jiang Xugao sharing the stage to directly address the industry opportunities and challenges under the demand for AI. The AI Empowerment and Global Layout Trend Forum invites representatives from key major manufacturers in the AI supply chain, including Zhiding Technology Group, Qinnuo Di Electronics and American Kelei, to discuss technology development and global layout under the AI trend. Lin Dinghao, deputy general manager of R&D at Jingshuo, will give a lecture on the application analysis of advanced packaging glass materials.

This year's eight major exhibition areas completely connect the industrial chain, covering carrier board and high-end circuit board manufacturing, high-quality new materials and chemicals, dry and wet process equipment, intelligent solutions, testing equipment, electronic assembly, SMT smart production and green technology. This year, in response to global market demand, an "Advanced Packaging Theme Zone" is specially planned.

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