The Ministry of Industry and Trade reported high rates of development of equipment for microelectronics

Brief retelling from RIA II

In Russia, the development of equipment for silicon wafers for microelectronics is progressing at a high pace.

It is planned to develop 90 types of equipment for wafers with a diameter of up to 200 millimeters, and about a quarter have already been developed in Russia.

The Russian Ministry of Industry and Trade will allocate 1.43 billion rubles to carry out development work to develop equipment for processing silicon wafers.

SIRIUS, September 28 - RIA Novosti. The development of equipment for silicon wafers for microelectronics in Russia is proceeding at a high pace, the head of the Ministry of Industry and Trade Anton Alikhanov told reporters.

“The pace of development is high. For wafers with a diameter of up to 200 millimeters inclusive, the development of 90 types of equipment is planned. About a quarter have already been developed in Russia - some with state support, some by our companies on our own initiative. This year we plan to complete more than 25 more developments,” the minister said.

He emphasized that such a pace will make it possible by 2028 to cover more than 75% of the needs of the domestic market by type of installation for wafers up to 150 millimeters inclusive. For 200 millimeters, the same level is planned to be achieved by 2030.