LG Electronics targets the global AI data center market with modular cooling infrastructure

LG Electronics [066570] is targeting the global artificial intelligence (AI) data center market with modular cooling infrastructure and liquid cooling solutions.

LG Electronics announced that it participated in 'Data Center World Asia (DCWA) 2026', Asia's largest data center exhibition, which opened in Singapore on the 29th, and introduced an integrated solution covering AI data center thermal management, power, and operation.

At this exhibition, LG Electronics unveiled for the first time its 'Hydronic Modular' solution, which bundles essential equipment such as pumps, valves, and emergency buffer tanks into one unit.

This solution involves pre-manufacturing pumps and piping inside an ISO standard container and supplying them as finished products. The feature is that the cooling system can be started immediately by simply connecting the chiller (freezer) and the container module.

In particular, LG Electronics explains that it can reduce the construction period and initial investment burden of an AI data center, and can quickly respond to the demand for AI server expansion.

In addition, LG Electronics also exhibited an air-cooled inverter turbo chiller that improved cooling efficiency by applying a magnetic bearing-based oil-free compressor.

As a liquid cooling solution, a 1 megawatt (㎿) and 2.6 MW coolant distribution unit (CDU) were unveiled. These two products, along with the 600 kilowatt (kW) class product, previously received Nvidia's quality standard approval.

Lee Jae-seong, head of LG Electronics' ES business division (president), said, "We will leap forward as a key partner in the global AI infrastructure market by taking the lead in cooling total solutions optimized for ultra-large AI data centers."